Hidehito Nishizawa

3 Patents

• US125596262026

  Resin Composition, Heat-radiating Member, and Electronic Apparatus

  SEKISUI CHEMICAL CO., Ltd.

  0 cites
• US123849502025

  Heat-dissipating Composition, Heat-dissipating Member, and Filler Aggregate for Heat-dissipating Member

  SEKISUI CHEMICAL CO., Ltd.

  0 cites
• US117023432023

  Diamond Particles, Diamond-containing Composition, and Method for Producing Diamond Particles

  SEKISUI CHEMICAL CO., Ltd.

  0 cites