Patents/Inventors

Hidefumi Saeki

OsakaJP1 patent

2 Patents

US116886412023
Element Chip Isolation Method Using Laser Grooving and Plasma Etching
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites
US115519742023
Manufacturing Process of Element Chip Using Laser Grooving and Plasma-etching
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites