Patents/Inventors

Hermes T. Apale

Shrewsbury, MAUS1 patent

2 Patents

US122117782025
Semiconductor Device and Method of Forming Bump Pad Array on Substrate for Ground Connection for Heat Sink/shielding Structure
STATS Chippac Pte. Ltd.
0 cites
US117641362023
Semiconductor Device and Method of Forming Bump Pad Array on Substrate for Ground Connection for Heat Sink/shielding Structure
STATS Chippac Pte. Ltd.
0 cites