Patents/Inventors

Henning Braunisch

Phoenix, AZUS36 patents

38 Patents

US125819382026
Package Architecture for Quasi-monolithic Chip with Backside Power
Intel Corporation
0 cites
US125819682026
Package Architecture of Large Dies Using Quasi-monolithic Chip Layers
Intel Corporation
0 cites
US125507682026
Conformal Power Delivery Structures Near High-speed Signal Traces
Intel Corporation
0 cites
US124944432025
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
Intel Corporation
0 cites
US124874202025
Apparatus and Method of Manufacturing a Vertically Disaggregated Photonic Device
Intel Corporation
0 cites
US124890322025
Cooling of Conformal Power Delivery Structures
Intel Corporation
0 cites
US122551582025
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US122552252025
Low Leakage Thin Film Capacitors Using Titanium Oxide Dielectric with Conducting Noble Metal Oxide Electrodes
Intel Corporation
0 cites
US122422902025
Integrating Voltage Regulators and Passive Circuit Elements with Top Side Power Planes in Stacked Die Architectures
Intel Corporation
0 cites
US122059022025
High-density Interconnects for Integrated Circuit Packages
Intel Corporation
0 cites
US121990672025
Scalable Embedded Silicon Bridge via Pillars in Lithographically Defined Vias, and Methods of Making Same
Intel Corporation
0 cites
US121763232024
Microelectronic Assemblies
Intel Corporation
0 cites
US121702442024
High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
0 cites
US121662612024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US121502712024
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US121260672024
Millimeter-wave Dielectric Waveguide Including an Opening of Varying Cross-section Enclosed Within a First Material and the First Material Surrounded by a Second Material
Intel Corporation
0 cites
US121260682024
Millimeter-wave Dielectric Waveguide Bundle Including First and Second Adjacent Dielectric Waveguides Having Different Core And/or Cladding Materials
Intel Corporation
0 cites
US121130262024
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US121073142024
Microelectronic Support for Millimeter-wave Communication Including a Transmission Line Trace and via Pad Spaced Apart from a Respective Anti-trace and Anti-pad
Intel Corporation
0 cites
US120876822024
Power Delivery Structures
Intel Corporation
0 cites
US120883602024
Dispersive Waveguide Crosstalk Mitigation
Intel Corporation
0 cites
US120212892024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US119556842024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US119166042024
Dispersion Compensation for Electromagnetic Waveguides
Intel Corporation
0 cites
US118814572024
Semiconductor Packaging with High Density Interconnects
Tahoe Research, Ltd.
0 cites
US118760532024
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US118240082023
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US118044552023
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
Intel Corporation
0 cites
US117915282023
Low Loss and Low Cross Talk Transmission Lines with Stacked Dielectric Layers for Forming Stubs of Different Thickness or for Forming a Coaxial Line
Intel Corporation
0 cites
US117644522023
Integrated Circuit Including a Dielectric Waveguide with a Cavity Therein Surrounded by a Conductive Coating Forming a Wall for the Cavity
Intel Corporation
0 cites
US117569482023
In Situ Package Integrated Thin Film Capacitors for Power Delivery
Intel Corporation
0 cites
US117282902023
Waveguide Fan-out
Intel Corporation
0 cites
US117216492023
Microelectronic Assemblies
Intel Corporation
0 cites
US117156932023
Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture
Intel Corporation
0 cites
US117168262023
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US116643032023
Interconnection Structure Fabrication Using Grayscale Lithography
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US115812722023
Contactless High-frequency Interconnect
Intel Corporation
0 cites