Patents/Inventors

Heng-ming Nien

TaoyuanTW5 patents

6 Patents

US124395292025
Plurality of Build-up Layers in a Circuit Board Structure
UNIMICRON TECHNOLOGY Corp.
0 cites
US120528152024
Manufacturing Method of Circuit Board
Unimicron Technology Corp.
0 cites
US118593022024
Electroplating Apparatus and Electroplating Method
Unimicron Technology Corp.
0 cites
US117929182023
Co-axial via Structure
Unimicron Technology Corp.
0 cites
US117857072023
Circuit Board and Manufacturing Method Thereof and Electronic Device
Unimicron Technology Corp.
0 cites
US116860082023
Electroplating Apparatus and Electroplating Method
Unimicron Technology Corp.
0 cites