Heng-chi Huang

4 Patents

• US125123952025

  Chip Packaging Method and Chip Package Unit

  RICHTEK TECHNOLOGY CORPORATION

  0 cites
• US123005652025

  Chip Package Unit and Chip Packaging Method

  RICHTEK TECHNOLOGY CORPORATION

  0 cites
• US119844192024

  Package Structure with a Barrier Layer

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US119730102024

  Chip Packaging Method and Chip Package Unit

  RICHTEK TECHNOLOGY CORPORATION

  0 cites