Hem P. Takiar

9 Patents

• US124447092025

  Overlapping Die Stacks for NAND Package Architecture

  Micron Technology, Inc.

  0 cites
• US124328592025

  Surface Mount Device Bonded to an Inner Layer of a Multi-layer Substrate

  Micron Technology, Inc.

  0 cites
• US122438072025

  Substrates for Semiconductor Packages, Including Hybrid Substrates for Decoupling Capacitors, and Associated Devices, Systems, and Methods

  Micron Technology, Inc.

  0 cites
• US119424602024

  Systems and Methods for Reducing the Size of a Semiconductor Assembly

  Micron Technology, Inc.

  0 cites
• US119293512024

  Integrated Circuit Wire Bonded to a Multi-layer Substrate Having an Open Area That Exposes Wire Bond Pads at a Surface of the Inner Layer

  Micron Technology, Inc.

  0 cites
• US119088332024

  Overlapping Die Stacks for Nand Package Architecture

  Micron Technology, Inc.

  0 cites
• US118942892024

  Substrates for Semiconductor Packages, Including Hybrid Substrates for Decoupling Capacitors, and Associated Devices, Systems, and Methods

  Micron Technology, Inc.

  0 cites
• US117231502023

  Surface Mount Device Bonded to an Inner Layer of a Multi-layer Substrate

  Micron Technology, Inc.

  0 cites
• US115629872023

  Semiconductor Devices with Multiple Substrates and Die Stacks

  Micron Technology, Inc.

  0 cites