Heinz Schmid

4 Patents

• US124631372025

  Integrated Circuit Device with Interconnects Made of Layered Topological Materials

  International Business Machines Corporation

  0 cites
• US120947602024

  High-transparency Semiconductor-metal Interfaces

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US117768092023

  Fabrication of a Semiconductor Device

  International Business Machines Corporation

  0 cites
• US117567882023

  Method for Growing a Metastable Crystalline Structure Which Is a 2-dimensional Planar Film from a Nanowire Metastable Seed Crystal Provided Inside a Template Structure

  International Business Machines Corporation

  0 cites