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Hei Seung Kim
Suwon-si
KR
2 patents
3 Patents
US12381169
2025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US12119336
2024
Fusion Memory Device and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11862476
2024
Method of Forming a Semiconductor Device Including an Active Region with Variable Atomic Concentration of Oxide Semiconductor Material
SAMSUNG ELECTRONICS CO., Ltd.
0 cites