46 Patents
- US126222772026Semiconductor Device and Method of Partial Shielding with Embedded Graphene Core Shells
STATS Chippac Pte. Ltd.
0 cites - US126103892026Method and Apparatus for Channel Information Transfer in Communication System
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US126047392026Semiconductor Device and Method of Forming a 3-D Stacked Semiconductor Package Structure
JCET STATS Chippac Korea Limited
0 cites - US125933972026Electronic Package and Method for Making the Same0 cites
- US125885722026Semiconductor Device and Method of Forming Fine Pitch Conductive Posts with Graphene-coated Cores
STATS Chippac Pte. Ltd.
0 cites - US125880172026Method and Apparatus of Multi-link Communication for Vehicle in Communication System Based on Frame Information Including Multiple Information Schemes
Electronics And Telecommunications Research Institute
0 cites - US125819742026Semiconductor Device and Method of Making a Semiconductor Package with Graphene-coated Interconnects
STATS Chippac Pte. Ltd.
0 cites - US125499952026Apparatus and Method for Transmission and Reception of Channel State Information Based on Artificial Intelligence
Electronics And Telecommunications Research Institute
0 cites - US125499682026Method and Apparatus for Configuring Artificial Neural Network for Wireless Communication in Mobile Communication System
Electronics And Telecommunications Research Institute
0 cites - US125431732026Method and Apparatus for Predicting Traffic and Transmitting a Buffer Prediction Status Report
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US125129492025Carrier Aggregation in Wireless Communication Systems
Electronics And Telecommunications Research Institute
0 cites - US125128922025Method for Mobile Backhaul Link Setup and Management
Electronics And Telecommunications Research Institute
0 cites - US124902472025Method and Apparatus for Transmitting Channel Information Based on Machine Learning
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US124644242025Method and Apparatus for Improving Handover Performance in Communication System
Electronics And Telecommunications Research Institute
0 cites - US124447182025Semiconductor Device and Method of Forming Compartment Shielding for a Semiconductor Package
JCET STATS Chippac Korea Limited
0 cites - US124314372025Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat Dissipation
JCET STATS Chippac Korea Limited
0 cites - US124009412025Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect Substrate
STATS Chippac Pte. Ltd.
0 cites - US124009292025Semiconductor Device and Method of Forming Graphene-coated Core Embedded Within TIM
STATS Chippac Pte. Ltd.
0 cites - US123851282025Cooling Device and Process for Cooling Double-sided Sip Devices During Sputtering
STATS Chippac Pte. Ltd.
0 cites - US123684732025Method and Apparatus for Codebook Design in Communication System
Electronics And Telecommunications Research Institute
0 cites - US123588542025Method and Apparatus for Converting Hydrocarbon-based Material Into Acetylene or Ethylene
KOREA INSTITUTE OF MACHINERY & MATERIALS
0 cites - US123563142025Beam Search Method and Apparatus in Smart Repeater System
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US122665872025Semiconductor Device and Method for Advanced Thermal Dissipation
STATS Chippac Pte. Ltd.
0 cites - US122666142025Molded Laser Package with Electromagnetic Interference Shield and Method of Making
STATS Chippac Pte. Ltd.
0 cites - US122181142025Semiconductor Device and Method of Making a Photonic Semiconductor Package
STATS Chippac Pte. Ltd.
0 cites - 0 cites
- US121927512025Method and Apparatus for Switching Aerial Base Stations in Wireless Communication System
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US121602932024Method and Apparatus for Initial Access in Communication System
Electronics And Telecommunications Research Institute
0 cites - US120890632024Method and Apparatus for Controlling Beam in Wireless Communication System
Electronics And Telecommunications Research Institute
0 cites - US120465642024Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
STATS Chippac Pte. Ltd.
0 cites - 0 cites
- US119329332024Cooling Device and Process for Cooling Double-sided Sip Devices During Sputtering
STATS Chippac Pte. Ltd.
0 cites - US119176692024Method and Apparatus for Transmitting and Receiving Signal for Cooperative Transmission in Communication System
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US118712872024Method and Apparatus for Handover in Wireless Communication System
Electronics And Telecommunications Research Institute
0 cites - US118559272023Method and Apparatus for Scheduling in Communication System Supporting Ultra-high Frequency and Ultra-wide Band
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
0 cites - US118429912023Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module
STATS Chippac Pte. Ltd.
0 cites - US118049382023Method and Apparatus for Transmitting Scrambled Data by User Equipment
Electronics And Telecommunications Research Institute
0 cites - US117977112023Electronic Device, Method for Providing Personal Information Using Same, and Computer-readable Recording Medium for Recording Same
Samsung Electronics Co., Ltd
0 cites - US117697302023Semiconductor Device and Method of Providing High Density Component Spacing
STATS Chippac Pte. Ltd.
0 cites - US117066712023Method and Apparatus for Conditional Handover Operation in Communication System
Electronics And Telecommunications Research Institute
0 cites - US116769112023Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
STATS Chippac Pte. Ltd.
0 cites - 0 cites
- 0 cites
- US116520652023Semiconductor Device and Method of Embedding Circuit Pattern in Encapsulant for SIP Module
STATS Chippac Pte. Ltd.
0 cites - US116520882023Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-package Modules with the Same
STATS Chippac Pte. Ltd.
0 cites - US115878822023Molded Laser Package with Electromagnetic Interference Shield and Method of Making
STATS Chippac Pte. Ltd.
0 cites