Heejin Cho

3 Patents

• US122322602025

  Electronic Device Having Multilayered Substrate and Manufacturing Method Thereof

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US120806742024

  Double-sided Cooling Type Power Module and Manufacturing Method Therefor

  LG Electronics Inc.

  0 cites
• US118108872023

  Double-sided Cooling Type Power Module and Manufacturing Method Therefor

  LG Electronics Inc.

  0 cites