Patents/Inventors

Heejae Nam

Anyang-siKR7 patents

6 Patents

US125139732025
Wafer Structure and Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US124514562025
Semiconductor Package Including Non-conductive Film and Method for Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US124128242025
Semiconductor Packages and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US120626262024
Semiconductor Substrate and Method of Sawing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120150052024
Semiconductor Package Including Non-conductive Film and Method for Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US116769142023
Semiconductor Substrate and Method of Sawing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites