Patents/Inventors

Hayato Iga

TokyoJP19 patents

16 Patents

US125936422026
Method of Processing a Wafer
DISCO CORPORATION
0 cites
US125605572026
Inspection Method of Workpiece and Inspection Apparatus
DISCO CORPORATION
0 cites
US125338302026
Substrate Manufacturing Method
DISCO CORPORATION
0 cites
US125387622026
Processing Method of Bonded Wafer
DISCO CORPORATION
0 cites
US125387632026
Bonded Wafer Processing Method
DISCO CORPORATION
0 cites
US125327152026
Processing Method of Bonded Wafer
DISCO CORPORATION
0 cites
US124790482025
Wafer Processing Apparatus
DISCO CORPORATION
0 cites
US124591472025
Cutting Apparatus
DISCO CORPORATION
0 cites
US124540762025
Substrate Manufacturing Method
DISCO CORPORATION
0 cites
US124475602025
Manufacturing Method of Single Crystal Silicon Substrate
DISCO CORPORATION
0 cites
US123549162025
Method of Processing Wafer
DISCO CORPORATION
0 cites
US123114702025
Method of Processing Monocrystalline Silicon Wafer
DISCO CORPORATION
0 cites
US122899222025
Processing Method
DISCO CORPORATION
0 cites
US122145262025
Method of Manufacturing Substrate
DISCO CORPORATION
0 cites
US122021732025
Method of Manufacturing Monocrystalline Silicon Substrate
DISCO CORPORATION
0 cites
US121295702024
Manufacturing Method of Single-crystal Silicon Substrate
DISCO CORPORATION
0 cites