Haruo Sudo

2 Patents

• US126221852026

  Method for Manufacturing Semiconductor Silicon Wafer Composed of Silicon Wafer Substrate and Silicon Monocrystalline Epitaxial Layer

  GLOBALWAFERS JAPAN CO., Ltd.

  0 cites
• US123718132025

  Silicon Wafer and Method for Producing Silicon Wafer

  TOHOKU UNIVERSITY

  0 cites