Hari Mahalingam

10 Patents

• US125910962026

  Technologies for a Beam Expansion and Collimation for Photonic Integrated Circuits

  Intel Corporation

  0 cites
• US125607712026

  Die First Fan-out Architecture for Electric and Optical Integration

  Intel Corporation

  0 cites
• US125469572026

  Photonic Integrated Circuit Packaging Architectures

  Intel Corporation

  0 cites
• US125298472026

  Multi-layer Silicon Photonics Apparatus

  Intel Corporation

  0 cites
• US125045812025

  Photonic Interconnect and Components in Glass

  Intel Corporation

  0 cites
• US123530702025

  Glass Interposer Optical Switching Device and Method

  Intel Corporation

  0 cites
• US123459322025

  Die Last and Waveguide Last Architecture for Silicon Photonic Packaging

  Intel Corporation

  0 cites
• US122161582025

  Contactless Optical Probing of Edge-coupled Photonic Ics

  Intel Corporation

  0 cites
• US121970042025

  Silicon Photonic Integrated Circuits on Substrates with Structured Insulators Having Specific Thicknesses in Separate Zones

  Intel Corporation

  0 cites
• US120192702024

  Multi-layer Silicon Photonics Apparatus

  Intel Corporation

  0 cites