17 Patents
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- US123549672025Chip Package Assembly, Electronic Device, and Preparation Method of Chip Package Assembly
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - US122939842025Method for Packaging Stacking Flip Chip
Hebei Beixin Semiconductor Technology Co., Ltd.
0 cites - US122880272025Text Sentence Processing Method and Apparatus, Computer Device, and Storage Medium
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
0 cites - US122848762025Array Substrate and Display Panel
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., Ltd.
0 cites - US121631742024Method for Producing Sclareol by Fermentation of Cigar Tobacco Flower Buds
Hubei University Of Technology
0 cites - US120461292024Computer-based Systems Configured for Space Object Orbital Trajectory Predictions and Methods Thereof
Rutgers, The State University Of New Jersey
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- US119978772024Array Substrate and Display Panel
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., Ltd.
0 cites - US119233802024Display Panel with LTPO TFT Having Top-gate Oxide TFT and Manufacturing Method Thereof
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., Ltd.
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- US116739512023Anti-pd1 Antibodies and Their Use as Therapeutics and Diagnostics
BEIGENE SWITZERLAND GmbH
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