Patents/Inventors

Hao-lin Yang

KaohsiungTW6 patents

3 Patents

US125988252026
Substrate Contact in Wafer Backside
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125817642026
Bond Structure Having Shielding Structures for Stacked IC Chips
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125574052026
Structure and Method for Backside-illuminated Image Device
TAIWAN SEMICONDUCTOR MANUFACUTURING COMPANY, Ltd
0 cites