Patents/Inventors

Hao-jan Pei

HsinchuTW22 patents

23 Patents

US125819772026
Bonding Through Multi-shot Laser Reflow
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125640082026
Method and Treatment System for Uniform Processing of Semiconductor Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125640542026
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125640552026
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124890302025
Methods of Manufacturing Integrated Fan-out Packages with Embedded Heat Dissipation Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124179272025
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123880602025
Integrated Fan-out Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123680532025
Method for Laser Drilling Process for an Integrated Circuit Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123681492025
Methods of Forming Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122665592025
Method of Manufacturing Semiconductor Package, Method of Handling Wafer, and Method of Handling Workpiece
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122610882025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122305972025
Package Structure with Warpage-control Element
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121763192024
Reflow Method and System
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121070642024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120403092024
Bonding Through Multi-shot Laser Reflow
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119964002024
Manufacturing Method of Package on Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119424642024
Semiconductor Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119012582024
Iintegrated Fan-out Packages with Embedded Heat Dissipation Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118625772024
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118307462023
Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117911922023
Workpiece Holder, Wafer Chuck, Wafer Holding Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117216592023
Package Structure with Warpage-control Element
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116108592023
Reflow Method and System
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites