Patents/Inventors

Han-wen Chen

Cupertino, CAUS14 patents

15 Patents

US124827362025
Semiconductor Device Packages
Applied Materials, Inc.
0 cites
US123880492025
High Connectivity Device Stacking
Applied Materials, Inc.
0 cites
US123746112025
Package Core Assembly and Fabrication Methods
Applied Materials, Inc.
0 cites
US123549682025
Reconstituted Substrate Structure and Fabrication Methods for Heterogeneous Packaging Integration
Applied Materials, Inc.
0 cites
US120876792024
Package Core Assembly and Fabrication Methods
0 cites
US119318552024
Planarization Methods for Packaging Substrates
Applied Materials, Inc.
0 cites
US118879342024
Package Structure and Fabrication Methods
Applied Materials, Inc.
0 cites
US118814472024
Package Core Assembly and Fabrication Methods
Applied Materials, Inc.
0 cites
US118625462024
Package Core Assembly and Fabrication Methods
Applied Materials, Inc.
0 cites
US118376802023
Substrate Structuring Methods
Applied Materials, Inc.
0 cites
US117988312023
Method for Substrate Registration and Anchoring in Inkjet Printing
Applied Materials, Inc.
0 cites
US117423302023
High Connectivity Device Stacking
Applied Materials, Inc.
0 cites
US117157002023
Reconstituted Substrate Structure and Fabrication Methods for Heterogeneous Packaging Integration
Applied Materials, Inc.
0 cites
US117053652023
Methods of Micro-via Formation for Advanced Packaging
Applied Materials, Inc.
0 cites
US116768322023
Laser Ablation System for Package Fabrication
Applied Materials, Inc.
0 cites