Patents/Inventors

Han-de Chen

HsinchuTW15 patents

15 Patents

US125576122026
Bonding System with Sealing Gasket and Method for Using the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
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US124890822025
Metal Nanoparticles in an Amorphous Bonding Layer Between a Device Substrate and Carrier Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123681292025
Temperature Controllable Bonder Equipment for Substrate Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123476962025
Laser De-bonding Carriers and Composite Carriers Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123278112025
Ion Implantation with Annealing for Substrate Cutting
Taiwan Semiconductor Manufacturing Co., Ltd.
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US122551712025
Wafer Bonding System and Method of Using the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122495922025
Dynamic Bonding Gap Control and Tool for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
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US122372112025
Bonding System with Sealing Gasket and Method for Using the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122305322025
Semiconductor Device, Method of Manufacture by Monitoring Relative Humidity, and System of Manufacture Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122118202025
Wafer Bonding Apparatus and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
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US121320792024
Bonding and Isolation Techniques for Stacked Transistor Structures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
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US119963172024
Methods for Forming Isolation Regions by Depositing and Oxidizing a Silicon Liner
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119087082024
Laser De-bonding Carriers and Composite Carriers Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118550402023
Ion Implantation with Annealing for Substrate Cutting
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118429332023
Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites