9 Patents
- US126160142026Semiconductor Device Including a Through Electrode Contacting a Backside Conductive Pattern and a Frontside Conductive Pattern and a Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US123006712025Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites - US118109002023Semiconductor Packages Stacked by Wafer Bonding Process and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US117988662023Semiconductor Device Including via Structures with Undercut Portions and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO, Ltd.
0 cites - US117911372023Apparatus for Etching Substrate Bevel and Semiconductor Fabrication Method Using the Same
Samsung Electronics Co., Ltd.
0 cites - US116949802023Semiconductor Stack and Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US116643162023Semiconductor Devices Having Penetration Vias with Portions Having Decreasing Widths
Samsung Electronics Co., Ltd.
0 cites