Patents/Inventors

Hajime Nakazono

KizugawaJP2 patents

3 Patents

US120161652024
Shield Package
Tatsuta Electric Wire & Cable Co., Ltd.
0 cites
US119128972024
Electroconductive Coating Material and Method for Producing Shielded Package Using Said Electroconductive Coating Material
Tatsuta Electric Wire & Cable Co., Ltd.
0 cites
US118345862023
Conductive Paint, Method for Producing Shield Package Using the Same, and Method for Producing Resin Molded Article Having Shield Layer
TATSUTA ELECTRIC WIRE & CABLE CO., Ltd.
0 cites