Hajime Itokawa

6 Patents

• US125402222026

  Fluoroplastic Substrate for High-speed Communications and Copper-clad Fluoroplastic Substrate for High-speed Communications

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US124418922025

  Low Dielectric Silica Powder, Resin Composition Containing the Silica Powder, and Method for Manufacturing Low Dielectric Silica Powder

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US121163042024

  Method for Packing Quartz Glass Cloth

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US120982902024

  Low Dielectric Silica Powder, Resin Composition Containing the Silica Powder, and Method for Manufacturing Low Dielectric Silica Powder

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US119200112024

  Resin Substrate Having Dielectric Characteristics with Little Frequency Dependence

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US118021922023

  Low Dielectric Resin Substrate

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites