Hailong Luo

9 Patents

• US125064582025

  Packaging Module and Packaging Method of BAW Resonator

  Ningbo Semiconductor International Corporation (Shanghai Branch)

  0 cites
• US122247302025

  Manufacturing Method of a Composite Substrate of an Acoustic Wave Resonator

  NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION

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• US120811912024

  Packaging Method of a Film Bulk Acoustic Resonator

  Ningbo Semiconductor International Corporation (Shanghai Branch)

  0 cites
• US120578202024

  Thin Film Piezoelectric Acoustic Wave Resonator and Manufacturing Method Therefor, and Filter

  NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION

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• US120280432024

  Packaging Method and Packaging Structure of FBAR

  Ningbo Semiconductor International Corporation

  0 cites
• US120098032024

  Bulk Acoustic Wave Resonator, Filter and Radio Frequency Communication System

  Ningbo Semiconductor International Corporation

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• US118704102024

  Packaging Method and Packaging Structure of Film Bulk Acoustic Resonator

  NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION

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• US117642452023

  Fabrication Method of Photodetector and Imaging Sensor

  NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION

  0 cites
• US115629802023

  Wafer-level Package Structure

  Ningbo Semiconductor International Corporation

  0 cites