Hae Sol Kang

7 Patents

• US122664792025

  Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121485742024

  Multilayer Capacitor and Board Having the Same Mounted Thereon

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US119357032024

  Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117840052023

  Multilayer Capacitor and Board Having the Same Mounted Thereon

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117353642023

  Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116369842023

  Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US115628592023

  MLCC Module and Method of Manufacturing the Same

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites