Patents/Inventors

Hae-jung Yu

SeoulKR3 patents

4 Patents

US122180702025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120806762024
Semiconductor Package Including a Molding Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358672024
Semiconductor Package with Memory Stack Structure Connected to Logic Dies via an Interposer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370702023
Method of Fabricating a Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites