Patents/Inventors

Gyujin Choi

Suwon-siKR7 patents

7 Patents

US124890602025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119904392024
Semiconductor Package Including Under Bump Metallization Pad
Samsung Electronics Co., Ltd.
0 cites
US119786962024
Semiconductor Package Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119729662024
Method of Manufacturing a Semiconductor Package Including Correcting Alignment Error While Forming Redistribution Wiring Struture
Samsung Electronics Co., Ltd.
0 cites
US119618122024
Semiconductor Packages Having Vias
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118108642023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115878982023
Semiconductor Packages Having Vias
Samsung Electronics Co., Ltd.
0 cites