Patents/Inventors

Gyuho Kang

Suwon-siKR11 patents

13 Patents

US125754372026
Redistribution Substrate, Semiconductor Package Including the Same, and Method of Fabricating Redistribution Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123811302025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123811512025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122180392025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121836642024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121193062024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121193312024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121070632024
Semiconductor Package Device
Samsung Electronics Co., Ltd.
0 cites
US120274822024
Semiconductor Chip Having a Through Electrode and Semiconductor Package Including the Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US117422712023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116826302023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US116768872023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116643122023
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites