Patents/Inventors

Gwangjae Jeon

Hwaseong-siKR11 patents

11 Patents

US124514492025
Semiconductor Package, and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123947002025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123005892025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122305562025
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US119488722024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US119293162024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118375512023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118044272023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117912952023
Semiconductor Package with Thick Under-bump Terminal
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117053412023
Method of Fabricating a Semiconductor Package Having Redistribution Patterns Including Seed Patterns and Seed Layers
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116462602023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites