Patents/Inventors

Gwang-soo Kim

Portland, ORUS5 patents

3 Patents

US125989962026
Passive Circuit on a Back-end-of-line of a Package
Intel Corporation
0 cites
US124698012025
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly
Intel Corporation
0 cites
US124314412025
Interlayer Dielectric Stack Optimization for Wafer Bow Reduction
Intel Corporation
0 cites