Patents/Inventors

Gwang Kim

Gyeongi-doKR3 patents

4 Patents

US123745592025
Double-sided Partial Molded Sip Module
STATS Chippac Pte. Ltd.
0 cites
US122118032025
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
STATS Chippac Pte. Ltd.
0 cites
US118943142024
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
STATS Chippac Pte. Ltd.
0 cites
US118878632024
Double-sided Partial Molded SIP Module
STATS Chippac Pte. Ltd.
0 cites