Guoliang Ye

7 Patents

• US126220732026

  Hybrid Image Sensor Having Dies Bonded to Pixel Substrate

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US125753832026

  Manufacturing Method for Semiconductor Device and Semiconductor Device

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US125387702026

  Interconnection Layer Filled in Through-silicon via (TSV) Semiconductor Device and Manufacturing Method Therefor

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

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• US125060952025

  Wafer Bonding Structure, Wafer Bonding Method and Chip Bonding Structure

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

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• US123681102025

  Wafer Assembly Having Alignment Marks, Method for Forming Same, and Wafer Alignment Method

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

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• US122439052025

  Method of Forming Metal Grid, Backside-illuminated Image Sensor and Method of Forming the Same

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• USD10023022023

  Bottle Holder

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