7 Patents
- US125388402026Semiconductor Device and Method of Forming Module-in-package Structure Using Redistribution Layer
STATS Chippac Pte. Ltd.
0 cites - 0 cites
- US124009412025Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect Substrate
STATS Chippac Pte. Ltd.
0 cites - US123278002025Semiconductor Device and Method for Selective EMI Shielding Using a Mask
STATS Chippac Pte. Ltd.
0 cites - US122887542025Semiconductor Device and Method of Stacking Devices Using Support Frame
STATS Chippac Pte. Ltd.
0 cites - 0 cites
- US118698482024Semiconductor Device and Method of Stacking Devices Using Support Frame
STATS Chippac Pte. Ltd.
0 cites