8 Patents
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- US123811392025Electronic Device and Multilevel Package Substrate with Elevated Trace Features for Solder And/or Die Confinement and Method for Fabricating the Electronic Device
TEXAS INSTRUMENTS INCORPORATED
0 cites - US122782052025Semiconductor Device Package with Improved Die Pad and Solder Mask Design
TEXAS INSTRUMENTS INCORPORATED
0 cites - US122602012025Application Deployment Method, Application Blueprint Generation Method, Platform, Terminal and Medium
ZTE CORPORATION
0 cites - US122438352025Package Substrate with CTE Matching Barrier Ring Around Microvias
TEXAS INSTRUMENTS INCORPORATED
0 cites - US119129192024Core-shell Quantum Dot, Preparation Method Thereof, and Electroluminescent Light-emitting Device Containing the Same
Najing Technology Corporation Limited
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