Patents/Inventors

Guandong Liu

HangzhouCN1 patent

2 Patents

US118760712024
System-on-wafer Structure and Fabrication Method
ZHEJIANG LAB
0 cites
US117768792023
Three-dimensional Stacked Package Structure with Micro-channel Heat Dissipation Structure and Packaging Method Thereof
ZHEJIANG LAB
0 cites