Patents/Inventors

Guan Huei See

SingaporeSG23 patents

21 Patents

US126105872026
Backside Power Rail to Deep Vias
Applied Materials, Inc.
0 cites
US125573432026
Method of Ultra Thinning of Wafer
Applied Materials, Inc.
0 cites
US125506622026
Integrated Process Flows for Hybrid Bonding
Applied Materials Inc.
0 cites
US124955822025
Self-aligned Wide Backside Power Rail Contacts to Multiple Transistor Sources
Applied Materials, Inc.
0 cites
US124696832025
Water Vapor Plasma to Enhance Surface Hydrophilicity
Applied Materials Inc.
0 cites
US124244462025
Silicon (si) Dry Etch for Die-to-wafer Thinning
APPLIED MATERIALS, Inc.
0 cites
US124179982025
Procedure to Enable Die Rework for Hybrid Bonding
APPLIED MATERIALS, Inc.
0 cites
US123745862025
Methods of TSV Formation for Advanced Packaging
Applied Materials, Inc.
0 cites
US123549682025
Reconstituted Substrate Structure and Fabrication Methods for Heterogeneous Packaging Integration
Applied Materials, Inc.
0 cites
US122371862025
On-board Cleaning of Tooling Parts in Hybrid Bonding Tool
APPLIED MATERIALS, Inc.
0 cites
US121387422024
Methods and Apparatus for Processing a Substrate
NATIONAL UNIVERSITY OF SINGAPORE
0 cites
US120875712024
Methods, Systems, and Apparatus for Tape-frame Substrate Cleaning and Drying
APPLIED MATERIALS, Inc.
0 cites
US120489482024
Methods for Forming Microwave Tunable Composited Thin-film Dielectric Layer
APPLIED MATERIALS, Inc.
0 cites
US120516532024
Reconstituted Substrate for Radio Frequency Applications
Applied Materials, Inc.
0 cites
US120209922024
Methods and Apparatus for Processing a Substrate
APPLIED MATERIALS, Inc.
0 cites
US120011932024
Apparatus for Environmental Control of Dies and Substrates for Hybrid Bonding
APPLIED MATERIALS, Inc.
0 cites
US118993762024
Methods for Forming Alignment Marks
APPLIED MATERIALS, Inc.
0 cites
US118548862023
Methods of TSV Formation for Advanced Packaging
Applied Materials, Inc.
0 cites
US118374642023
Methods, Systems, and Apparatus for Tape-frame Substrate Cleaning and Drying
APPLIED MATERIALS, Inc.
0 cites
US117910942023
Semiconductor Substrate Having Magnetic Core Inductor
APPLIED MATERIALS, Inc.
0 cites
US117157002023
Reconstituted Substrate Structure and Fabrication Methods for Heterogeneous Packaging Integration
Applied Materials, Inc.
0 cites