Gu Won Ji

5 Patents

• US124379122025

  Coil Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117696332023

  Board Having Multilayer Capacitor Mounted Thereon and Multilayer Capacitor Package

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117494622023

  Multilayer Ceramic Electronic Component and Board Having the Same Mounted Thereon

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116408772023

  Electronic Component and Board Having the Same

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US115811472023

  Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites