Gregor Langer

5 Patents

• US125000862025

  Method of Manufacturing a Metal Silicide Layer Above a Silicon Carbide Substrate, and Semiconductor Device Comprising a Metal Silicide Layer

  INFINEON TECHNOLOGIES AG

  0 cites
• US125015512025

  Method for Embedding a Component in a Printed Circuit Board

  AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

  0 cites
• US123825852025

  Method for Embedding a Component in a Printed Circuit Board

  AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

  0 cites
• US123277272025

  Chip with a Silicon Carbide Substrate

  Infineon Technologies AG

  0 cites
• US117988072023

  Process for Producing an Electrical Contact on a Silicon Carbide Substrate

  Infineon Technologies AG

  0 cites