Greg P. Klowak

2 Patents

• US117768832023

  Embedded Die Packaging for Power Semiconductor Devices

  Gan Systems Inc.

  0 cites
• USRE0496032023

  Gan-on-si Semiconductor Device Structures for High Current/ High Voltage Lateral Gan Transistors and Methods of Fabrication Thereof

  GAN SYSTEMS Inc.

  0 cites