Patents/Inventors

Gookmi Song

Hwaseong-siKR4 patents

5 Patents

US125002182025
Fan-out Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123880002025
Semiconductor Package Including Redistribution Pattern
Samsung Electronics Co., Ltd.
0 cites
US121763082024
Package Substrate and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US118943332024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117569082023
Package Substrate Including a Redistribution Pad Extending from a Redistribution Layer and Including Segmenting Grooves Along a Redial Direction Thereof and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites