Patents/Inventors

Gianni Signorini

Garching bei MuenchenDE5 patents

4 Patents

US123947262025
Method to Implement Wafer-level Chip-scale Packages with Grounded Conformal Shield
Intel Corporation
0 cites
US123083352025
Integrating and Accessing Passive Components in Wafer-level Packages
Intel Corporation
0 cites
US120806552024
Method to Implement Wafer-level Chip-scale Packages with Grounded Conformal Shield
Intel Corporation
0 cites
US116462882023
Integrating and Accessing Passive Components in Wafer-level Packages
Intel Corporation
0 cites