Patents/Inventors

Gerald Pasdast

San Jose, CAUS28 patents

26 Patents

US125917272026
Lane Repair and Lane Reversal Implementation for Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US125783842026
Unified Test and Debug Chiplet Architecture
Intel Corporation
0 cites
US125050652025
On-package Die-to-die (D2D) Interconnect for Memory Using Universal Chiplet Interconnect Express (ucie) PHY
Intel Corporation
0 cites
US124990192025
Retimers to Extend a Die-to-die Interconnect
Intel Corporation
0 cites
US124990742025
Die-to-die Interconnect Protocol Layer
Intel Corporation
0 cites
US125005832025
Clock Interpolation System for Eye-centering
INTEL CORPORATION
0 cites
US124816142025
Standard Interfaces for Die to Die (D2D) Interconnect Stacks
Intel Corporation
0 cites
US124685972025
Valid Signal for Latency Sensitive Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US124059122025
Link Initialization Training and Bring Up for Die-to-die Interconnect
Intel Corporation
0 cites
US123622842025
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US123623062025
Clock-gating in Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US123533052025
Compliance and Debug Testing of a Die-to-die Interconnect
Intel Corporation
0 cites
US123328262025
Die-to-die Interconnect
Intel Corporation
0 cites
US123213052025
Sideband Interface for Die-to-die Interconnects
Intel Corporation
0 cites
US123157942025
Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites
US123062162025
Dynamic Voltage Regulator Sensing for Chiplet-based Designs
Intel Corporation
0 cites
US122887462025
Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites
US121643192024
Dual Loop Voltage Regulator
Intel Corporation
0 cites
US121598402024
Scalable and Interoperable PHYLESS Die-to-die IO Solution
Intel Corporation
0 cites
US121006622024
Power-forwarding Bridge for Inter-chip Data Signal Transfer
Intel Corporation
0 cites
US120149902024
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US118996152024
Multiple Dies Hardware Processors and Methods
Intel Corporation
0 cites
US117496492023
Composite IC Chips Including a Chiplet Embedded Within Metallization Layers of a Host IC Chip
Intel Corporation
0 cites
US116949862023
Vias in Composite IC Chip Structures
Intel Corporation
0 cites
US116520592023
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US115865792023
Multiple Dies Hardware Processors and Methods
Intel Corporation
0 cites