Patents/Inventors

Gerald Lackner

ArnoldsteinAT4 patents

5 Patents

US122058422025
Wafer Chuck for a Laser Beam Wafer Dicing Equipment
Infineon Technologies AG
0 cites
US121486402024
Method and Apparatus for Use in Wafer Processing
Infineon Technologies AG
0 cites
US118482372023
Composite Wafer, Semiconductor Device and Electronic Component
Infineon Technologies AG
0 cites
US117127492023
Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
Infineon Technologies AG
0 cites
US116370282023
Method and Apparatus for Use in Wafer Processing
INFINEON TECHNOLOGIES AG
0 cites