Patents/Inventors

Georgios Dogiamis

Chandler, AZUS46 patents

49 Patents

US125002072025
Packaging Architecture with Intermediate Routing Layers
Intel Corporation
0 cites
US124696302025
Inductor and Transformer Semiconductor Devices Using Hybrid Bonding Technology
Intel Corporation
0 cites
US124699542025
High Precision Scalable Packaging Architecture Based on Radio Frequency Scanning
Intel Corporation
0 cites
US124631562025
Packaging Architectures for Sub-terahertz Radio Frequency Devices
Intel Corporation
0 cites
US124245632025
Disaggregated Entropy Services for Microelectronic Assemblies
Intel Corporation
0 cites
US124069622025
Power Delivery Through Capacitor-dies in a Multi-layered Microelectronic Assembly
Intel Corporation
0 cites
US123411142025
Microelectronic Assemblies Having a Hybrid Bonded Interposer for Die-to-die Fan-out Scaling
Intel Corporation
0 cites
US123277952025
Waveguide Interconnect Bridges
Intel Corporation
0 cites
US123005792025
Liquid Cooled Interposer for Integrated Circuit Stack
Intel Corporation
0 cites
US122668402025
Waveguide Interconnects for Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US122610972025
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US122551582025
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US121990122025
Modular Microchannel Thermal Solutions for Integrated Circuit Devices
Intel Corporation
0 cites
US121702442024
High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
0 cites
US121662612024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US121553722024
Multi-filter Die
Intel Corporation
0 cites
US121502712024
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US121260672024
Millimeter-wave Dielectric Waveguide Including an Opening of Varying Cross-section Enclosed Within a First Material and the First Material Surrounded by a Second Material
Intel Corporation
0 cites
US121260682024
Millimeter-wave Dielectric Waveguide Bundle Including First and Second Adjacent Dielectric Waveguides Having Different Core And/or Cladding Materials
Intel Corporation
0 cites
US121073142024
Microelectronic Support for Millimeter-wave Communication Including a Transmission Line Trace and via Pad Spaced Apart from a Respective Anti-trace and Anti-pad
Intel Corporation
0 cites
US120876822024
Power Delivery Structures
Intel Corporation
0 cites
US120883602024
Dispersive Waveguide Crosstalk Mitigation
Intel Corporation
0 cites
US120403072024
Magnetic Induced Heating for Solder Interconnects
Intel Corporation
0 cites
US120407762024
Integrated Radio Frequency (RF) Front-end Module (FEM)
Intel Corporation
0 cites
US120212892024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US120071702024
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US119904192024
Physically Unclonable Function Circuitry of a Package Substrate and Method of Providing Same
Intel Corporation
0 cites
US119844392024
Microelectronic Assemblies
Intel Corporation
0 cites
US119556842024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US119166042024
Dispersion Compensation for Electromagnetic Waveguides
Intel Corporation
0 cites
US118958152024
Additive Manufacturing for Integrated Circuit Assembly Cables
Intel Corporation
0 cites
US118879442024
Additive Manufacturing for Integrated Circuit Assembly Connectors
Intel Corporation
0 cites
US118428262023
Additive Manufacturing for Integrated Circuit Assembly Connector Support Structures
Intel Corporation
0 cites
US118307872023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US118308312023
Semiconductor Package Including a Modular Side Radiating Waveguide Launcher
Intel Corporation
0 cites
US117841082023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US117644522023
Integrated Circuit Including a Dielectric Waveguide with a Cavity Therein Surrounded by a Conductive Coating Forming a Wall for the Cavity
Intel Corporation
0 cites
US117282902023
Waveguide Fan-out
Intel Corporation
0 cites
US117216502023
Method for Fabricating Multiplexed Hollow Waveguides of Variable Type on a Semiconductor Package
Intel Corporation
0 cites
US117156932023
Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture
Intel Corporation
0 cites
US117168262023
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US116949622023
Microelectronic Package with Mold-integrated Components
Intel Corporation
0 cites
US116886602023
Bridge for Radio Frequency (RF) Multi-chip Modules
Intel Corporation
0 cites
US116522642023
Microelectronic Assemblies with Substrate Integrated Waveguide
Intel Corporation
0 cites
US116417112023
Microelectronic Package with Substrate-integrated Components
Intel Corporation
0 cites
US116211922023
Inorganic Dies with Organic Interconnect Layers and Related Structures
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US115948012023
Mmwave Dielectric Waveguide Interconnect Topology for Automotive Applications
Intel Corporation
0 cites
US115812722023
Contactless High-frequency Interconnect
Intel Corporation
0 cites