15 Patents
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- US125737442026Wideband Antennas in Glass Through Direct via Feeding and Glass Stacking
Intel Corporation
0 cites - US125423582026Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites - US124891892025Contactless Communication Using a Waveguide Extending Through a Substrate Core
Intel Corporation
0 cites - US124446192025Physical Vapor Deposition Seeding for High Aspect Ratio Vias in Glass Core Technology
Intel Corporation
0 cites - US124247162025RF Filters and Multiplexers Manufactured in the Core of a Package Substrate Using Glass Core Technology
Intel Corporation
0 cites - US124247192025Compact Surface Transmission Line Waveguides with Vertical Ground Planes
Intel Corporation
0 cites - US123680912025Package Substrate with Glass Core Having Vertical Power Planes for Improved Power Delivery
Intel Corporation
0 cites - US123477612025Magnetic Planar Spiral and High Aspect Ratio Inductors for Power Delivery in the Glass-core of a Package Substrate
Intel Corporation
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- US121551332024Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites - US116584182023Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites - US115757492023Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture in Autonomous Cars
Intel Corporation
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