Patents/Inventors

Gary J. Dispoto

Palo Alto, CAUS13 patents

15 Patents

US122692162025
Similarity-based Additive Manufacturing Alterations
PERIDOT PRINT LLC
0 cites
US121453152024
Three-dimensional Printing
Hewlett-packard Development Company, L.P.
0 cites
US121453192024
Temperature Prediction in Three-dimensional (3D) Parts
Hewlett-packard Development Company, L.P.
0 cites
US121157332024
Unfused Thermal Support Area in 3D Fabrication Systems
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US119810872024
Three-dimensional (3D) Printed Objects with Fracture Channels
Hewlett-packard Development Company, L.P.
0 cites
US119644362024
Patterns on Objects in Additive Manufacturing
Hewlett-packard Development Company, L.P.
0 cites
US119045352024
Hybrid Part-accessory Connections
Hewlett-packard Development Company, L.P.
0 cites
US117244482023
Disguising Color in 3D Object Formation
Hewlett-packard Development Company, L.P.
0 cites
US116913392023
Product Framing
Hewlett-packard Development Company, L.P.
0 cites
US116608232023
Unfused Thermal Support Area in 3D Fabrication Systems
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US116286272023
Additive Manufacturing Process to Disguise Physical Characteristics of Item
Hewlett-packard Development Company, L.P.
0 cites
US116078422023
Thermal Supports for 3D Features Formed from Particles
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US115971432023
Additive Manufacturing Process Using Fusing and Non-fusing Printing Fluids
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US115774632023
Patterns on Objects in Additive Manufacturing
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites
US115654722023
Additively Formed 3D Object with Conductive Channel
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
0 cites