13 Patents
- US126222952026Signal-heat Separated TMV Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US125990192026Embedded Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US125989912026Liquid Circulating Cooling Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US125885432026Embedded Flip Chip Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US125507742026Carrier Plate for Preparing Package Substrate, Package Substrate Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US124514472025Substrate Embedded with Integrated Inductor and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US122793772025Conductive Substrate and Carrier Plate Wiring Structure with Filtering Function, and Manufacturing Method of Same
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US122144982025Robot Joint Torque Control System and Load Compensation Method Therefor
BEIJING INSTITUTE OF TECHNOLOGY
0 cites - US120782342024Lightweight High Load-bearing Reducer and Method for Generating Bionic Bone Structure of Gear Thereof
Beijing Institute Of Technology
0 cites - 0 cites
- US119612772024Image Information Detection Method and Apparatus and Storage Medium
Tsinghua University
0 cites - US119031332024Structure for Embedding and Packaging Multiple Devices by Layer and Method for Manufacturing Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US116185192023Method of Tracking Control for Foot Force and Moment of Biped Robot
BEIJING INSTITUTE OF TECHNOLOGY
0 cites