Patents/Inventors

Gang Duan

Chandler, AZUS49 patents

43 Patents

US125936952026
Structure and Process for Warpage Reduction
INTEL CORPORATION
0 cites
US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US125575942026
Device and Method for Real-time Offset Adjustment of a Semiconductor Die Placement
Intel Corporation
0 cites
US125435782026
Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
0 cites
US124762142025
Solder Interconnect Hierarchy for Heterogeneous Electronic Device Packaging
Intel Corporation
0 cites
US124567052025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US124119392025
Vertically Integrated Automatic Threat Level Determination for Containers and Hosts in a Containerization Environment
SUSE LLC
0 cites
US124128682025
Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
0 cites
US124003632025
Device and Method for Improved Fiducial Marker Detection
Intel Corporation
0 cites
US123548832025
Omni Directional Interconnect with Magnetic Fillers in Mold Matrix
Intel Corporation
0 cites
US123549922025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123277972025
Microelectronic Structures Including Glass Cores
Intel Corporation
0 cites
US123083292025
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US122446252025
Application Layer Data Protection for Containers in a Containerization Environment
SUSE LLC
0 cites
US122304302025
Substrate Embedded Magnetic Core Inductors and Method of Making
Intel Corporation
0 cites
US121912402025
Hybrid Glass Core for Wafer Level and Panel Level Packaging Applications
Intel Corporation
0 cites
US121521302024
Wood Article and Process for the Preparation of the Wood Article
GUANGDONG HUARUN PAINTS CO., Ltd
0 cites
US121257772024
Minimizing Package Impedance Discontinuity Through Dielectric Structure Optimizations
Intel Corporation
0 cites
US121257932024
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US120876952024
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US120885602024
Network Context Monitoring Within Service Mesh Containerization Environment
SUSE LLC
0 cites
US120655772024
Wood Article and Process for the Preparation of the Wood Article
GUANGDONG HUARUN PAINTS CO., Ltd
0 cites
US120093202024
Interconnect Loss of High Density Package with Magnetic Material
Intel Corporation
0 cites
US119877192024
Aqueous Dispersion of Inorganic Fibers and Method for Formulating Aqueous Coating Composition Therefrom
SWIMC LLC
0 cites
US119904272024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119786852024
Glass Core Patch with in Situ Fabricated Fan-out Layer to Enable Die Tiling Applications
Intel Corporation
0 cites
US119730412024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119664632024
Automatic Deployment of Application Security Policy Using Application Manifest and Dynamic Process Analysis in a Containerization Environment
SUSE LLC
0 cites
US119292122024
Method to Form High Capacitance Thin Film Capacitors (tfcs) as Embedded Passives in Organic Substrate Packages
Intel Corporation
0 cites
US119233072024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US118865732024
Vertically Integrated Automatic Threat Level Determination for Containers and Hosts in a Containerization Environment
SUSE LLC
0 cites
US118145462023
Photoinitiating Composition Suitable for UV-LED Light Irradiation and an Aqueous Coating Composition Prepared Therefrom
Guangdong Huarun Paints Co., Ltd
0 cites
US118173492023
Conductive Route Patterning for Electronic Substrates
Intel Corporation
0 cites
US117922162023
Application Layer Data Protection for Containers in a Containerization Environment
SUSE LLC
0 cites
US117802102023
Glass Dielectric Layer with Patterning
Intel Corporation
0 cites
US117697352023
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US117568902023
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US117392332023
Aqueous Dispersion of Polymeric Particles Having Core-shell Structure, the Preparation Thereof and the Coating Formed Therefrom
Guangdong Huarun Paints Co., Ltd.
0 cites
US116462742023
Multi-package Assemblies Having Foam Structures for Warpage Control
Intel Corporation
0 cites
US116224482023
Sandwich-molded Cores for High-inductance Architectures
Intel Corporation
0 cites
US115748622023
Optimal Signal Routing Performance Through Dielectric Material Configuration Designs in Package Substrate
Intel Corporation
0 cites
US115490322023
Water Dispersible Copolymers for Scavenging Formaldehyde
SWIMC LLC
0 cites