Gabriel Z. Guevara

7 Patents

• US126222072026

  Apparatus for Separating Singulated Die from Substrate Dicing Tape and Methods of Using the Same

  Adeia Semiconductor Bonding Technologies Inc.

  0 cites
• US125637492026

  Stacked Electronic Devices

  ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc

  0 cites
• US122726772025

  Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics

  ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.

  0 cites
• US121240352024

  Stretchable Film Assembly with Conductive Traces

  Adeia Semiconductor Technologies LLC

  0 cites
• US120573832024

  Bonded Structures with Integrated Passive Component

  ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.

  0 cites
• US119554632024

  Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics

  ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.

  0 cites
• US116263632023

  Bonded Structures with Integrated Passive Component

  ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.

  0 cites