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Inventors
Fumitomo Watanabe
Akita
JP
1 patent
2 Patents
US12119325
2024
Semiconductor Device Assemblies with Molded Support Substrates
Micron Technology, Inc.
0 cites
US11742252
2023
Shielded Fan-out Packaged Semiconductor Device and Method of Manufacturing
Micron Technology, Inc.
0 cites